2. SMT / THT

In the SMT [surface mounted technology] sector we produce all the standard types - from the smallest, e.g. 0201, to large and complex types, e.g. 85 x 85 mm.You can rely on Zollner when it comes to fine-pitch ICs, CSPs, low-speed BGAs, etc. All components are soldered with full convection nitrogen reflow soldering systems or by the vapour phase method.

We also offer a broad manufacturing spectrum - both automatic and manual - in through hole technology [THT]. For this purpose we employ full tunnel nitrogen wave soldering machines and a wide range of selective soldering procedures. Our applications range from common soldering methods such as spot wave or dip soldering to special methods such as induction soldering.

• Further to Pressfit technology
• Back to Production of printed circuit boards