- DFM analyses
- production technologies
[SMT | THT | ROHS conforming, non-conforming | etc.]
- component mould
[passive components 0603 - 0201 | QFP | QFN | PGA | BGA | CSP | FC | MCM | lead-free components | etc.]
- connecting technologies
[vapour phase soldering | wave soldering | selective soldering | reflow soldering | hot gas soldering | stamp soldering | micro-flame soldering | induction soldering | manual welding | laser soldering | conductive adhesion | heat-seal embossing | insert-mount technology | pressed screen technology | resistance welding | ultrasonic welding | crimp technology | etc.]
- product finishing
[partial coating and painting | full contour milling | moulding technology | etc.]
- PCB marking
- component and process traceability
- inserted PCBs
[single- to multilayer | copper core | aluminium core | flexible | flex-rigid | ceramic substrate PCBs]
- different batch sizes, high variant variety
- processing of standard sizes, special dimensions and shapes
- production on most up-to-date plant and machines
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